AMD Ryzen™ AI Max+ 395 –EVO-X2 AI Mini PC

$2,399

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Parameter Details
CPU AMD Ryzen™ AI Max+ 395
• 16 cores / 32 threads
• TSMC 4nm FinFET process
• Up to 5.1 GHz (MAX)
• 16 MB L2 Cache / 64 MB L3 Cache
• TDP: runs steadily at 120W (peak up to 140W)
GPU Radeon 8060S Graphics
• 40-core RDNA 3.5 architecture
AI NPU Based on XDNA 2 architecture
• 50 TOPS
• Overall processor performance up to 126 TOPS• LM Studio: AI performance 2.2× higher than NVIDIA RTX 4090 with lower power consumption
Memory (RAM) Onboard LPDDR5X (non-upgradeable)
• Options: 64GB or 128GB
• Speed: 8000MHz
Primary Storage (ROM) PCIe 4.0 M.2 2280 SSD
• Capacities: 2TB or 4TB
• Supports PCIe 3.0/4.0 (SATA drives are not supported)
Internal Storage Expansion Dual M.2 2280 slots
• Maximum total storage: 16TB (each slot supports up to 8TB via PCIe GEN4 x4)
Video Output Available via HDMI, DisplayPort, and USB4
• Maximum supported resolution: 7680×4320 @ 60Hz
Network (WiFi & LAN) WiFi:
• Wifi7: RZ717(MT7925)
Ethernet:
• 1 × RJ45 Gigabit LAN (2.5G, 8125BG)
Bluetooth Bluetooth 5.4
Power – Charger DC 19.5V, 11.8A (~230.1W)
• AC Input: 100–240V, 50/60Hz, 4.0A
Front Panel I/O • 2 × USB-A 3.2 Gen2
• 1 × Audio Combo (3.5mm jack)
• 1 × USB Type-C (USB4.0)
• 1 × SD Card Reader (SD4.0, supports SDXC)
• Buttons: Power, System Fan Lighting Control, Performance Mode Switch
Rear Panel I/O • 1 × DisplayPort 1.4 HBR3 (8.1 Gbps)
• 1 × HDMI 2.1 (FRL at 8 Gbps)
• 1 × USB-A 3.2 Gen2
• 2 × USB-A 2.0
• 1 × USB Type-C (USB4.0)
• 1 × Audio (3.5mm CTIA)
• 1 × DC IN (5525 interface)
• 1 × RJ45 Gigabit LAN (2.5G, 8125BG)
OS • Window 11 Pro
Chassis / Form Factor • Dimensions: 193 mm x 185.8 mm x 77 mm
• Chassis finish: B/C-grade metal with CNC sandblasted oxidized finish; A-shell plastic spray coating
LLM support • 64GB+1TB:DeepSeek-Rl: 32B
• 128GB+2TB:DeepSeek-Rl: 32B, DeepSeek-R1: 70B, Lama 4: 109B
Options

128GB RAM + 2TB SSD, 64GB RAM + 1TB SSD

Power Plug Type

US

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